We are your competent partner for electronic assemblies that range from surface mount (SMT) and through-hole (TH) as well as wire harnesses all the way to complete product box build services and panel assembly. REYcomp has over 25 years of experience in miniaturization of Printed Circuit Board Assembly. Our Siemens machines cover the complete spectrum of case sizes, including QFB, BGA µBGA, CBDA, CSP, and Flip-Chip. We excel at pre and post manufacturing support of your project for the entire life cycle. From parts procurement to FAI to COO management to our after sales Repair Service− even for third party products.