We specialize in packaging of microelectronic components for high-reliability military, space, and Class III medical device applications.

Our specialty is instruction and training in microelectronic packaging materials and processes. We also provide consulting services with expertise in materials and processes used to assemble hybrids, multichip modules, microwave hybrids, RF/MMIC modules, MEMS, medical implants, optoelectronics, sensors and other types of packaged microcircuits. Specific areas of expertise include hermeticity and "near hermetic" packaging, substrate fabrication, die attach, wirebond, visual inspection, materials ...

Our specialty is instruction and training in microelectronic packaging materials and processes. We also provide consulting services with expertise in materials and processes used to assemble hybrids, multichip modules, microwave hybrids, RF/MMIC modules, MEMS, medical implants, optoelectronics, sensors and other types of packaged microcircuits. Specific areas of expertise include hermeticity and "near hermetic" packaging, substrate fabrication, die attach, wirebond, visual inspection, materials and process development, process improvement via SPC/DOE analytical methods, failure analysis/root cause identification, and corrective actions.