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Electronic Manufacturing Services

First Level Inc. is a Electronic Manufacturing Service Supplier specializing in Microelectronic Packaging for Medical, Optoelectronics, Photonics, Semiconductor,Light Engines,Mems, Sensors, Accelerometers, etc. We specialize in Die/Wire Bonding Techniques typically in Flip Chip Packaging. Facility has Class 10,000 ESD Cean Rooms. Prototype to Production Assembly Services. Located near York, Pa, between Baltimore, Md and Harrisburg, Pa.

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  • Mon 8:00 AM - 5:00 PM
    OPEN NOW
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