About
Wafer Bumping and Redistribution
Electroplated Gold, Copper, Nickel, Indium, Tin/Lead and Lead-Free bumping Aluminum, Copper/Nickel or Gold Redistribution Single sided Interposers using aluminum, copper, nickel or gold traces. Substrate sizes from 50 to 300 mm (2" - 12") Silicon, GaAs, GaN, Ceramic and Glass Substrates processed ISO 9000 and ITAR Registered Employee owned
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Current Hours
- Sun CLOSED
- Mon 8:00 AM - 6:00 PM
- Tue 8:00 AM - 6:00 PM
- Wed 8:00 AM - 6:00 PM
- Thu 8:00 AM - 6:00 PM
- Fri 8:00 AM - 6:00 PM
- Sat CLOSED
-
Fri 8:00 AM - 6:00 PMOPEN NOW
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Detailed Information
- Location TypeHQ
- Opening Date2002
- Annual Revenue Estimate$1 to 2.5 million
- SIC Code show
- Employees10 to 19
- Contactsshow
- CEO, President Don Prusha
- Email [email protected]
- CFO Mark Rowe
- Email [email protected]
- Production Manager Djohan Sutedja
- Email [email protected]
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