Package Science Services specializes in microelectronic, LED, PV packaging, PCB and system design and characterization. Our services include high-frequency measurements, models and simulation, thermal measurements and modeling, product development, failure analysis and other engineering and technical services. Development and design of all package types from low lead count devices such as LED's to 3D, high performance multilayer high-lead count packages and everything in-between. We support all phases of package and PCB design from concept through design, layout, prototype, to hand-off to mass manufacturing. We also provide support for the supply chain to help manage costs and fit the right supplier for your needs. Call or email for more information.